| 1. | Soft solder alloys - chemical compositions and forms
软钎焊合金.化学成份和形状 |
| 2. | Soft solder alloys . chemical compositions and forms
软焊料合金.化学成分和表格 |
| 3. | Soft solder alloys ; chemical compositions and forms iso 9453 : 1990 ; german version en 29453 : 1993
软钎料合金.化学成分和形式 |
| 4. | Lead as soldering alloy in high performance communication electronic board and hexavalent chromium ( cr - vi ) )
用于高功率通讯电子板及六价铬中作为焊锡合金的铅。 |
| 5. | A study on the multiaxial time - dependent constitutive model with nonproportionality of 96 . 5sn - 3 . 5ag solder alloy
钎料合金的含非比例度的多轴时相关本构模型研究 |
| 6. | An introduction to eutectic au sn solder alloy and its preforms in microelectronics optoelectronic packaging applications
金锡焊料及其在电子器件封装领域中的应用 |
| 7. | Requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications
电子钎焊用电子级钎料合金及助熔和非助熔固体钎料的要求 |
| 8. | Solder alloys are selected for their properties to flow , sealing ability , electrical conductivity , and for general body work to provide a smooth surface for finishing
选择软焊合金时应考虑其流动性、密封能力和导电性，此外？以提供光滑的加工表面。 |
| 9. | Attachment materials for electronic assembly - requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications
电子组件用的连接材料.电子焊接设备用的电子分级焊料合金和助熔剂和非助熔剂的要求 |
| 10. | Attachment materials for electronic assembly - part 1 - 3 : requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications
电子组件用连接材料.第1 - 3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料的要求 |
